TIF100-50-56E UL-94 V0 Flame Rating Conductive Pad For GPU Cooling
High Quality Thermal Conductive Pad For AI Processors
The TIF®100-50-56E Series is a well-balanced,general-purpose thermal pad. It offers
excellent thermal conductivity and moderate hardness . This
balanced design provides both good surface conformity and excellent
ease of use,making it capable of effectively transferring heat and
providing basic physical protection for a wide range of electronic
components. It is an ideal choice for addressing medium to high
power heat dissipation needs, achieving the best balance between
costand performance.
Features:
> Good thermal conductivity: 5.0W/mK
> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface
adhesives
> Good insulation performance
> RoHS compliant
> UL recognized
Applications
> AI Servers, Inverters, Telecom Devices
> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
| Typical Properties of TIF®100-50-56E Series |
| Property | Value | Test method |
| Color | Green | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Density(g/cm³) | 3.3 | ASTM D792 |
| Thickness Range(inch/mm) | 0.010~0.020 (0.25~0.50) | 0.030~0.200 (0.75~5.0) | ASTM D374 |
| Hardness | 65 Shore 00 | 35 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | *** |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant | 8.5 MHz | ASTM D150 |
| Volume Resistivity | ＞1.0X1014 Ohm-meter | ASTM D257 |
| Flame rating | V-0 | UL 94 (E331100) |
| Thermal conductivity | 5.0 W/m-K | ASTM D5470 |
| 5.0 W/m-K | ISO22007 |
Product Specifications
Standard Thickness: 0.010"(0.250 mm)-0.20" (5.00 mm) with
increments of 0.01 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries
in English of course.
Standard Export Carton Or Marked With Customer's Information Or
Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if
you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory
solution.
