TIF500-50-11ES Electrically Isolating Multiple Thickness Factory
Thermal Pad Pad For Electric Products
Product descriptions
TlF®500-50-11ES is a thermal pad specifically designed to address the
most demanding thermal challenges and highly sensitive mechanical
stress environments. Combining exceptional thermal conductivity
with near-fluid softness, it ensures perfect filing of contact
interfaces even under ultra-low installation pressure, completely
eliminating air thermal resistance. This delivers an outstanding
thermal management solution and physical protection for the most
precise and high-heat-flux-density electronic components.
Features
> Good thermal conductive 5.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
Application
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
| Typical Properties of TIF®500-50-11ES Series |
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | ****** |
| Thickness range(inch/mm) | 0.02"~0.03"/ (0.50mm)~(0.75mm) | 0.04"~0.20"/ (1.0mm)~(5.0mm) | ASTM D374 |
| Density | 3.3g/cm³ | ASTM D792 |
| Hardness | 10 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | > 5500 VAC | ASTM D149 |
| Dielectric Constant | 3.8 MHz | ASTM D150 |
| Volume Resistivity | ＞1.0 X1012 Ohm-meter | ASTM D257 |
| Flame rating | 94 V0 | UL E331100 |
| Thermal conductivity | 5.0 W/m-K | ASTM D5470 |
Product Specification
Standard Thickness: 0.02"(0.50 mm)~0.20” (5.00 mm) with increments
of 0.01 inch (0.25 mm).
Standard Size: 16" ×16" (406 mm×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided
hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIFseriesis available in custom shapes and various forms.For
other thicknessesormore
information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and
manufacturing superior thermal interface materials for competitive
market. Our vast experience allows us to assist our customers best
in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make
your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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