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TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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    Buy cheap TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor from wholesalers
     
    Buy cheap TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor from wholesalers
    • Buy cheap TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor from wholesalers
    • Buy cheap TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor from wholesalers

    TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

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    Brand Name : Ziitek
    Model Number : TIF100-30-02US
    Certification : UL and RoHs
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 100000pcs/day
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

    TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor


    Ziitek TIF®100-30-02US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0.


    Features:


    > Good thermal conductive: 3.0W/mK
    > Moldability for complex parts
    > Soft and compressible for low stress applications
    > Naturally tacky needing no further adhesive coating
    > Available in varies thicknesses
    > Easy release construction
    > Electrically isolating
    > High durability


    Applications:


    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > Heat Sinking Housing at LED-lit BLU in LCD
    > LED TV and LED-lit lamps
    > RDRAM memory modules
    > Micro heat pipe thermal solutions
    > Automotive engine control units
    > Telecommunication hardware
    > Handheld portable electronics
    > Semiconductor automated test equipment (ATE)
    > CPU
    > Display card
    > Mainboard/mother board
    > Notebook
    > Power supply


    Typical Properties of TIF®100-30-02US Series
    PropertyValueTest method
    ColorGrayVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Specific Gravity2.9g/ccASTM D297
    Thickness range0.020"(0.5mm)~0.200"(5.0mm)******
    Hardness20 Shore 00ASTM 2240
    Continuos Use Temp-40 to 160℃*****
    Dielectric Breakdown Voltage>5500 VACASTM D149
    Dielectric Constant3.8 MHzASTM D150
    Volume Resistivity(Ohm-cm)1.0X10¹²ASTM D257
    Flame rating94 V0UL E331100
    Thermal conductivity3.0W/m-KASTM D5470


    Products Thickness:
    0.020 inch to 0.200 inch(0.5mm to 5.0mm)


    Products Size:

    8"*16"(203mm*406mm)
    TIF series Individual die cut shapes can be supplied.


    Peressure Sensitive Adhesive:
    Request adhesive on one side with "A1" suffix.
    Request adhesive on double side with "A2" suffix.

    Reinforcement:
    TIF series sheets type can add with fiberglass reinforced.
    TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor
    Company Profile

    With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


    Independent R&D team


    Q: How do I place an order?

    A:1. Click the "Sent messages" button to continue with the process.

    2. Fill out the message form by entering a subject line, and message to us.

    This message should include any questions you might have about the products as well as your purchase requests.

    3. Click the "Send" button when you are finished to complete the process and send your message to us.

    4. We will reply you as soon as possible with Email or online.

    TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

    Quality TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor for sale
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