TIF500-30-11ES RoHS Compliant Resistant Flame-Retardant Insulation
3.0W/MK Silicone Thermal Pad
Product descriptions
TlF500-30-11ES Series thermal silicone pad is a product with both
performance and economy. It is a unique thermal pad with low oil
permeability, low thermal resistance, high softness and high
compliance.It can work stably at -45℃~200℃ and meet the requirement
of UL94V0.
Features
> Good thermal conductive 3.0W/mK
> Moldability for complex parts
> Broad range of hardnesses available
> High tack surface reduces contact resistance
> Easy release construction
> Electrically isolating
> High durability
Application
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Semiconductor automated test equipment (ATE)
> CPU
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
| Typical Properties of TIF500-30-11ES Series |
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | ***** |
| Specific Gravity | 3.0g/cc | ASTM D792 |
| Thickness range | 0.030"(0.75mm)~0.200"(5.0mm) | ASTM D374 |
| Hardness | 20±5 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ***** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.0 MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
| Flame rating | 94 V0 | UL E331100 |
| Thermal conductivity | 3.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Standard Thicknesses
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Vietnam Ziitek Electronic Material Technology Co., Ltd. was
established in 2006. Is a high-tech enterprise specializing in the
research, development, production and sales of thermal interface
materials. We mainly produce: heat-conducting joint filler, low
melting point thermal interface materials, heat-conducting
insulator, heat-conducting adhesive tape, heat-conducting interface
pad and heat-conducting grease, heat-conducting plastic, silicone
rubber, silicone rubber foam, etc. We adhere to the business
philosophy of "survival by quality, development by quality", and
continue to provide the most efficient and best service for new and
old customers with excellent quality in the spirit of rigor,
pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team,
engineering team, R&D team, Manufacturing team, logistics team.
All is for supporting and servicing a satisfy service for
customers.
