Thermal Conductive Silicone Pad For Notebook Memory Motherboard
Display Insulated CPU Computer Accessories
Product descriptions
TIF®800QE series of thermal interface materials is specifically designed to fill
air gaps between heat-generating components and heat sinks or metal
baseplates. It offers excellent compliance, alowing it to conform
fightly to heat sources with varying shapes and height dferences.
Even in confined or iregular spaces,it maintains stable thermal
conductivity, enabling efficient heat transfer from discrete
components or the entire PCB to the metal housing or heat sink.
This significantly improves the heat dissipation efficiency of
electronic components, thereby enhancing operational stability and
extending device lifespan.
Features:
> Excellent thermal conductivity 13.0W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application
environments
> Available in different thickness options
> Easy release construction
> Electrically isolating
> High durability
Applications:
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
| Typical Properties of TIF®800QE Series |
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.7g/cc | ASTM D297 |
| thickness | 0.030"(0.75mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 35 (Shore 00) | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant | 8.0MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 13.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Product Specification
Product Thicknesses: 0.03"(0.75mm)~0.200"(5.00mm) with increments
of 0.01(0.25mm)
Product Sizes:16" x 16"(406mm x406mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided
hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
Notes:FG (Fiberglass) provides enhanced strength, suitable for
materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
The TIF series is available in custom shapes and various forms.For
other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates
too much heat affecting its high performance when using. Plus
thermal products can control and manage heat to keep it cool to
some extent.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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